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HITACHI Solder-Plated Copper Wire is specially produced by high-tech electroplating techniques to meet very stringent and under high-grade quality standards.
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| Type 1 |
TPA (Tin-Plated Annealed) |
| Size |
0.400 - 1.200 mm |
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Chemical Composition |
Tin (Sn) 95%Lead (Pb) 5%
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| Plating Thickness |
Any thickness between 2-16 micron
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Applications:
Lead wires of resistors, capacitors, inductors, condensers, flexible flat cables, electrical switches, jumper wires or other electronic components.
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Quality Features:
- Uniform thickness of solder-plating
- Good adhesion between solder and copper
- Stable solderability after high temperature heating
- Good corrosion resistance and anti-oxidation
- Smooth surface and free from rough deposits
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Packing Style:
| No |
Items |
Contents |
| 1. |
Packing |
Pack |
Spool |
| 2. |
Type of Packing |
SP |
SF |
P-3 |
P-5 |
| 3. |
Winding Weight (kg) |
22 |
3 |
5 |
| 4. |
Dimension (mm) |
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A |
278 |
278 |
130 |
160 |
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B |
305 |
285 |
60 |
70 |
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C |
261 |
218 |
110 |
114 |
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D |
145 |
153 |
10 |
12 |
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E |
- |
- |
20 |
20 |
Legend:
1) "SP" denotes Plastic Pack (recyclable)
2) "SF" denotes Fibre Pack (one-way)
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